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J-STD-001HS-DE Papierversion
Ergänzung Elektronik-Hardware für Raumfahrt- und Militäranwendungen zu IPC J-STD-001H Anforderungen an gelötete elektrische und elektronische Baugruppen
Deutsch. 36 Seiten. Stand: Mai 2021.
Die Richtlinie IPC J-STD-001HS-DE Ergänzung für Raumfahrt-Anwendungen ergänzt oder ersetzt spezifisch identifizierte Anforderungen von IPC J-STD-001H-DE für gelötete elektrische und elektronische Baugruppen, die Schwingungen und die Umgebungsbedingungen thermischer Zyklen von Raumfahrt und militärischen Anwendungen überstehen müssen.
J-STD-003C-WAM1&2 (Hardcopy)
Solderability Tests for Printed Boards
Englisch. Stand: Oktober 2012, 27 Seiten
J-STD-003C prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands and plated-through holes utilizing either tin-lead or lead-free solders. This standard is intended for use by both vendor and user. The objective of the solderability test methods described in this standard is to determine the ability of printed board surface conductors, attachment lands and plated-through holes to wet easily with solder and to withstand the rigors of the printed board assembly processes. This standard describes test methods by which both surface conductors (and attachment lands) and plated-through holes may be evaluated for solderability.
Revision "C" contains the latest information about gauge repeatability and reproducibility (GR&R) of solderability tests as well as updated illustrations.
J-STD-003C-WAM1&2 (PDF)
Solderability Tests for Printed Boards
Englisch. Stand:2014, 27 Seiten. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
J-STD-003C prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands and plated-through holes utilizing either tin-lead or lead-free solders. This standard is intended for use by both vendor and user. The objective of the solderability test methods described in this standard is to determine the ability of printed board surface conductors, attachment lands and plated-through holes to wet easily with solder and to withstand the rigors of the printed board assembly processes. This standard describes test methods by which both surface conductors (and attachment lands) and plated-through holes may be evaluated for solderability.
Revision "C" contains the latest information about gauge repeatability and reproducibility (GR&R) of solderability tests as well as updated illustrations.
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J-STD-003D (Hardcopy)
Solderability Tests for Printed Boards
Englisch. Stand: Januar 2023, 44 Seiten
The IPC J-STD-003D standard describes solderability determinations that are made to verify that the printed board fabrication processes and subsequent storage have had no adverse effect on the solderability of those portions of the printed board intended to be soldered. Solderability is determined by evaluation of a test specimen which has been processed as part of a panel of boards and subsequently removed for testing per the method selected. IPC J-STD-003D provides solderability test methods to determine the acceptance of printed board surface conductors, attachment lands, and plated-through holes to wet easily with solder, and to withstand the rigors of the printed board assembly processes.
J-STD-003D (PDF) Single User
Solderability Tests for Printed Boards
Englisch. Stand: Januar 2023, 44 Seiten.
The IPC J-STD-003D standard describes solderability determinations that are made to verify that the printed board fabrication processes and subsequent storage have had no adverse effect on the solderability of those portions of the printed board intended to be soldered. Solderability is determined by evaluation of a test specimen which has been processed as part of a panel of boards and subsequently removed for testing per the method selected. IPC J-STD-003D provides solderability test methods to determine the acceptance of printed board surface conductors, attachment lands, and plated-through holes to wet easily with solder, and to withstand the rigors of the printed board assembly processes.
J-STD-004B w/Amend 1 (PDF) Single User
Requirements for Soldering Fluxes
Englisch. 20 pages. Stand: November 2011; inkl. Amendment 1; Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. This standard may be used for quality control and procurement purposes. The purpose of this standard is to c lassify and characterize tin/lead and lead-free soldering flux materials for use in electronic metallurgical interconnections for printed circuit board assembly. Soldering flux materials include the following: liquid flux, paste flux, solder paste, s older cream, and flux-coated and flux-cored solder wires and preforms. It is not the intent of this standard to exclude any acceptable flux or soldering material; however, these materials must produce the desired electrical and metallurgical intercon nection. 20 pages. Released December 2008.
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J-STD-004C (Hardcopy)
Requirements for Soldering Fluxes
Englisch. 32 pages. Stand: Januar 2022
The IPC J-STD-004C standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. The IPC J-004C standard may be used for quality control and procurement purposes.
J-STD-004C (PDF) Single User
Requirements for Soldering Fluxes
Englisch. 32 pages. Stand: Januar 2022
The IPC J-STD-004C standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. The IPC J-004C standard may be used for quality control and procurement purposes.
J-STD-005A (Hardcopy)
Requirements for Soldering Pastes
Englisch. 10 pages. Stand: Februar 2012
This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball,tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment (not included with purchase of this standard). Supersedes J-STD-005. 10 pages.Released February 2012.
J-STD-005A (PDF) Single User
Requirements for Soldering Pastes
Englisch. 10 pages. Stand: Februar. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball,tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment (not included with purchase of this standard). Supersedes J-STD-005. 10 pages.Released February 2012.
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