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IPC-4202C (PDF) Single User
Specification for Flexible Base Dielectrics for use in Flexible Printed Boards
Englisch. 28 Seiten. Stand: Januar 2022. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
The IPC-4202C standard covers the requirements for flexible base materials, herein referred to as laminates, prepregs or films, to be used primarily for flexible printed boards for electrical and electronic circuits.
IPC-4203B (Hardcopy)
Cover and Bonding Material for Flexible Printed Circuitry
Englisch. 44 pages. Stand: Januar 2013
IPC-4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. IPC-4203B does not cover non-flexible adhesives designed to be used in the rigid board areas of rigid flex constructions, which are covered in IPC-4101. Materials such as liquid-applied covercoat (see 3.1.8.3) are covered in IPC-SM-840 and are excluded from this document. 38 pages.
IPC-4203B (PDF) Single User
Cover and Bonding Material for Flexible Printed Circuitry
Englisch. 44 Seiten. Stand: Januar 2013. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
PDF-Datei ist DRM geschützt (rechnergebunden)! Bitte nennen Sie beim Kauf den vollständigen Namen und die E-Mailadresse des Users.
IPC-4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. IPC-4203B does not cover non-flexible adhesives designed to be used in the rigid board areas of rigid flex constructions, which are covered in IPC-4101. Materials such as liquid-applied covercoat (see 3.1.8.3) are covered in IPC-SM-840 and are excluded from this document. 38 pages.
IPC-4204A-WAM1 (Hardcopy)
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
Englisch.53 pages. Stand: Oktober 2011
This standard establishes the classification system, the qualification and quality performance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed circuitry and
flexible flat cable. It encompasses 12 specification sheets that result from the combinations of various copper foil claddings; a polymer base dielectric selected from at least two polyesters, multiple polyimides or
liquid crystal polymers; and at least seven versions of polymer adhesives as well as adhesiveless bonding agents. The net result of these material combinations provide the industry with suitable clad, flexible
dielectrics for fabricating flexible printed circuitry interconnections.
IPC-4204A-WAM1 (PDF) Single User
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
Englisch. 53 Seiten. Stand: Oktober 2011. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This standard establishes the classification system, the qualification and quality performance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed circuitry and
flexible flat cable. It encompasses 12 specification sheets that result from the combinations of various copper foil claddings; a polymer base dielectric selected from at least two polyesters, multiple polyimides or
liquid crystal polymers; and at least seven versions of polymer adhesives as well as adhesiveless bonding agents. The net result of these material combinations provide the industry with suitable clad, flexible
dielectrics for fabricating flexible printed circuitry interconnections.
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IPC-4204B (Hardcopy)
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
Englisch. 56 Seiten. Stand: August 2018
IPC-4204B establishes the classification system, the qualification and quality performance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed boards. It encompasses 12 specification sheets that result from the combinations of various copper foil claddings; a polymer base dielectric selected from polyesters, polyimides, liquid crystal polymers and at least nine versions of polymer adhesives as well as adhesiveless bonding agents. The net result of these material combinations provide the industry with suitable clad, flexible dielectrics for fabricating flexible printed board interconnections. IPC-4204B also addresses how to utilize legacy designs that refer to earlier, out-of-date material designations.
Artikel-Nr. 3565
IPC-4204B (PDF) Single User
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
Englisch. 56 Seiten. Stand: August 2018
IPC-4204B establishes the classification system, the qualification and quality performance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed boards. It encompasses 12 specification sheets that result from the combinations of various copper foil claddings; a polymer base dielectric selected from polyesters, polyimides, liquid crystal polymers and at least nine versions of polymer adhesives as well as adhesiveless bonding agents. The net result of these material combinations provide the industry with suitable clad, flexible dielectrics for fabricating flexible printed board interconnections. IPC-4204B also addresses how to utilize legacy designs that refer to earlier, out-of-date material designations
IPC-4411A (PDF) Single User
Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
Englisch. 22 pages. Stand: November 2003. Keine Druckberechtigung, DRM-Schutz, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Covers the nomenclature, definitions and requirements for reinforcement made from nonwoven para-aramid fibers. Para-aramid reinforcement is primarily used in PCBs for HDI and high speed/high frequency applications. IPC-4411A also includes specificati on sheets, which can be used when selecting and purchasing nonwoven para-aramid reinforcement. Includes the incorporation of 14 new nonwoven para-aramid reinforcement specification sheets and the deletion of four nonwoven para-aramid materials that a re no longer commercially available. Due to a test method correction, all specification sheets have been updated. 22 pages.
IPC-4412B (Hardcopy)
Specification for Finished Fabric Woven from E Glass for Printed Boards
Englisch. 27 pages. Released: 06/2013
IPC-4412B exhaustively covers the classification and requirements for finished fabrics that are formed by plain woven glass fiber yarns. Simply, these yarns are appropriately sized bundles of continuous filament, electrical-grade ("E" glass) borosilicate glass. Bulk "E" glass, for ease of description, is composed of a blend of raw metal oxides that form a borosilicate glass upon melting. Once melted, the glass formed loses all relation to the raw metal oxides, including the network forming boron oxides or borates. This specification includes two extensive tables of finished fabric glass styles, one in SI (metric) units and the other in U.S. (English) units. Supersedes IPC-4412A with Amendments 1, 2 and 3, IPC-EG-140 with Amendments 1 & 2 and, in turn, IPC-EG-140.
IPC-4412B (PDF) Single User
Specification for Finished Fabric Woven from E Glass for Printed Boards
Englisch. 27 seiteb. Stand: Juni 2013. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC-4412B exhaustively covers the classification and requirements for finished fabrics that are formed by plain woven glass fiber yarns. Simply, these yarns are appropriately sized bundles of continuous filament, electrical-grade ("E" glass) borosilicate glass. Bulk "E" glass, for ease of description, is composed of a blend of raw metal oxides that form a borosilicate glass upon melting. Once melted, the glass formed loses all relation to the raw metal oxides, including the network forming boron oxides or borates. This specification includes two extensive tables of finished fabric glass styles, one in SI (metric) units and the other in U.S. (English) units. Supersedes IPC-4412A with Amendments 1, 2 and 3, IPC-EG-140 with Amendments 1 & 2 and, in turn, IPC-EG-140.
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