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IPC-9241 (Hardcopy)
Guidelines for Microsection Preparation
Englisch. 44 Seiten, Stand 2016, (Hardcopy)
This standard is intended as a guideline in the proper preparation of a metallographic sample (microsection) of a printed board. The finished microsection is used for evaluating the quality of the laminate system and plated structures (e.g. PTHs and vias). Microsection sample preparation is regarded by many as a highly developed skill. The guidelines in this standard discuss the many variables and problems associated with the process from sample removal to micro-etch. The guidelines do not promote any one vendor’s process, but discuss the variables common to microsectioning.
IPC-9241 (PDF) Single User
Guidelines for Microsection Preparation
Englisch. 44 Seiten, Stand 2016, (PDF) Single User, Keine Druckberechtigung, DRM-geschützt
This standard is intended as a guideline in the proper preparation of a metallographic sample (microsection) of a printed board. The finished microsection is used for evaluating the quality of the laminate system and plated structures (e.g. PTHs and vias). Microsection sample preparation is regarded by many as a highly developed skill. The guidelines in this standard discuss the many variables and problems associated with the process from sample removal to micro-etch. The guidelines do not promote any one vendor’s process, but discuss the variables common to microsectioning.
IPC-9252B (Hardcopy)
Requirements for Electrical Testing of Unpopulated Printed Boards
Englisch. 28 Seiten. Stand: 2016
IPC-9252 defines levels of appropriate testing and assists in the selection of the test analyzer, test parameters, test data and fixturing required to perform electrical test(s) on unpopulated printed boards and innerlayers. Revision B provides new requirements for resistive and indirect continuity and isolating testing, test record marking and traceability and an updated sample electrical test certificate of conformance (C of C).
IPC-9252B (PDF) Single User
Requirements for Electrical Testing of Unpopulated Printed Boards
Englisch. 28 Seiten. Stand: 2016. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
IPC-9252 defines levels of appropriate testing and assists in the selection of the test analyzer, test parameters, test data and fixturing required to perform electrical test(s) on unpopulated printed boards and innerlayers. Revision B provides new requirements for resistive and indirect continuity and isolating testing, test record marking and traceability and an updated sample electrical test certificate of conformance (C of C).
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IPC-9257 (Hardcopy)
Requirements for Electrical Testing of Flexible Printed Electronics
Englisch. 28 Seiten. Stand: Februar 2021
The IPC-9257 standard assists in selecting the test equipment, test parameters, test data and fixturing required to perform electrical test(s) on flexible printed electronics. Electrical testing of flexible printed electronics ensures conformance to electrical design requirements specified in IPC-6902. The IPC-9257 standard defines different levels of testing available to achieve this purpose.
IPC-9261A (PDF) Single User
In-Process DPMO and Estimated Yield for PCAs
Englisch. Stand: Oktober 2006; 12 Seiten. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Now updated to align with IPC-7912A for end item DPMO, this document defines consistent methodologies for computation of in-process defects per million opportunities (DPMO) metrics for any evaluation stage in the assembly process. It is intended for use in measuring in-process assembly steps rather than end product determination. Calculation of completed item DPMO is addressed in IPC-7912A. A guide to defect categorization is provided that can serve as a base for summarizing and reporting in-pro cess defects when used with J-STD-001 and IPC-A-610. It can also be used to develop process step estimated yield - the expected percentage of assemblies with no defects for a particular process step or combined process steps, based on historical defe ct rates.
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IPC-9500-K (PDF) Single User
Assembly Process Component Simulations, Guidelines & Classifications Package
Englisch. 79 pages. Set: IPC-9501 bis IPC-9504. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Here's a convenient and cost effective way to own the complete set of process simulation documents for component attachment. This set of four documents, 9501-9504, contains the information you need to help you select components that will be compatibl e with your assembly process. Learn about manufacturing solder process limits, moisture sensitivity classifications, preconditioning and assembly process simulations. Save 50% on individual document prices. Each document is also available on its own. 79 total pages.
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IPC-9501 (PDF) Single User
PWB Assembly Process Simulation for Evaluation of Electronic Components
Englisch. 25 pages. Stand: Juli 1995. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Will the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that components chosen meet expected reliability requirements after exposure to factory processes. This document specific ally addresses preconditioning of components. Developed for users and manufacturers, the procedure consists of a set of simulations for IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes and exposure to often-used cleaning materials. 25 pages.
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IPC-9502 (PDF) Single User
PWB Assembly Soldering Process Guideline for Electronic Components
Englisch. 12 pages. Stand: April 1999. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This document describes the manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and J-STD-020 would survive. It does not include optimum conditions for assembly, but provides guidelines to ensure components are not dam aged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the incr eased temperature requirements of lead-free solders. 12 pages.
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IPC-9505 (Hardcopy)
Guideline Methodology for Assessing Component and Cleaning Materials Compatibility
Englisch, 52 Seiten, Stand September 2017, Hardcopy
The IPC-9505 standard provides details of test methodologies for cleaning chemistry compatibility with electronic assembly materials that replace those in MIL-STD-202 Method 215 for testing electronic and electrical components such as capacitors, resistors, transformers and inductors. The test methods can also be used, when applicable, to parts not covered by military specifications or drawings.
