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IPC-7527-DE Papierversion
Anforderungen an den Lotpastendruck
Deutsch, Stand: Mai 2012, 14 Seiten, farbige Abbildungen
Die IPC-7527 ist eine Sammlung visueller Qualitätsbewertungskriterien für den Lotpastendruck. Zweck dieser Richtlinie ist es, den Anwender bei der Sichtevaluierung des Lotpastendruckprozesses zu unterstützen und dadurch eine Prozessoptimierung zu ermöglichen.
Dabei werden die bekannten IPC-Klassen 1, 2 und 3 und die dazugehörigen Abnahmekriterien für die Zustände: Anzustreben, Zulässig und Fehler. Für einzelne Abnahmekriterien werden auch Festlegungen zum Zustand: Prozessindikator getroffen.
In Anhang A werden verschiedene Fehlerarten angegeben sowie Lösungen dafür vorgeschlagen. Diese Richtlinie soll den Optimierungsprozess für den Lotpastendruck unterstützen/optimieren.
Ziel dieser Richtlinie ist nicht, die Qualität der Lotpaste zu prüfen und bewerten. Informationen zur Evaluierung von Lotpaste finden sich in der IPC-J-STD-005, Anforderungen an Lotpasten und im Handbuch IPC-HDBK-005. Ziel ist auch nicht die Festlegung von Anforderungen an das Design von Druckschablonen, Informationen zum Design von Druckschablonen finden sich in IPC-7525, Designrichtlinie für Druckschablonen.
IPC-7530A (Hardcopy)
Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
Englisch. 42 Seiten. Stand: März 2017
This standard provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This revision expands the focus of the original standard from reflow profiling to include profiling for vapor phase, laser, selective soldering and wave soldering. The revision also includes a full-color troubleshooting guide for addressing common defects which can be attributed to profiling. 42 pages. Released March 2017
IPC-7530A (PDF) Single User
Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
Englisch. 42 Seiten. Stand: März 2017. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This standard provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This revision expands the focus of the original standard from reflow profiling to include profiling for vapor phase, laser, selective soldering and wave soldering. The revision also includes a full-color troubleshooting guide for addressing common defects which can be attributed to profiling. 42 pages. Released March 2017
PDF-Datei ist DRM geschützt (rechnergebunden)! Bitte nennen Sie beim Kauf den vollständigen Namen und die E-Mailadresse des Users.
IPC-7621 (PDF) Single User
Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
Englisch, Stand Januar 2018, Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Encapsulation, for the purpose of IPC-7621 standard, is defined as a low pressure molded thermoplastic, e.g., polyamide, which is brought to a liquid state and injection molded and (rather quickly) returned to a temperature below its melting point., forming a durable yet pliable (rubbery-like) form. The desired performance characteristics of low pressure molding (LPM) encapsulation depend on the application and must be considered when selecting material. Users are urged to consult material suppliers for detailed technical data. The IPC-7621 standard will aid the user in understanding the capabilities and limits of LPM using thermoplastics. It is the responsibility of the user to determine the suitability, via appropriate testing, of the selected encapsulation and if the application method is suitable for a particular end use application, including but not limited to:
a. Inhibit current leakage and short circuit due to humidity and contamination from service environment.
b. Inhibit corrosion, tarnish.
c. Encapsulation may help in reducing the stresses due to CTE mismatches.
d. Inhibit arcing and corona, in particular, for high voltage applications.
e. Provide mechanical support and to prevent damages due to mechanical shock and vibration.
f. Provide a mitagation method limiting the growth of tin-whiskers.
g. Promote longer life in battery operated devices by limiting parasitic voltage leaching.
h. Inhibit ability of dendritic element formation.
i. Prevent damage of circuit by assemblers, installers and end users.
The acceptability criteria listed in IPC-7621 standard were chosen with the intent that the printed board assemblies would not be seen by the end user. If the LPM is to be used as the final housing, more restrictions may be set on aesthetics. The acceptability criteria for any one project may be unique and should be considered by the design team and consensus reached between designer, tool makers and part manufacturers prior to engaging in a tooling process. The resulting quality and workmanship acceptability may fall beyond the limits called for in this document. If so, those requirements will be As Agreed Between User and Supplier (AABUS).
PDF-Datei ist DRM geschützt (rechnergebunden)! Bitte nennen Sie beim Kauf den vollständigen Namen und die E-Mailadresse des Users.
IPC-7621 Hardcopy
Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
Englisch, Stand Januar 2018
Encapsulation, for the purpose of IPC-7621 standard, is defined as a low pressure molded thermoplastic, e.g., polyamide, which is brought to a liquid state and injection molded and (rather quickly) returned to a temperature below its melting point., forming a durable yet pliable (rubbery-like) form. The desired performance characteristics of low pressure molding (LPM) encapsulation depend on the application and must be considered when selecting material. Users are urged to consult material suppliers for detailed technical data. The IPC-7621 standard will aid the user in understanding the capabilities and limits of LPM using thermoplastics. It is the responsibility of the user to determine the suitability, via appropriate testing, of the selected encapsulation and if the application method is suitable for a particular end use application, including but not limited to: Inhibit current leakage and short circuit due to humidity and contamination from service environment.
Inhibit corrosion, tarnish.
Encapsulation may help in reducing the stresses due to CTE mismatches.
Inhibit arcing and corona, in particular, for high voltage applications.
Provide mechanical support and to prevent damages due to mechanical shock and vibration.
Provide a mitigation method limiting the growth of tin-whiskers.
Promote longer life in battery operated devices by limiting parasitic voltage leaching.
Inhibit ability of dendritic element formation.
Prevent damage of circuit by assemblers, installers and end users.
IPC-7711/21C (Hardcopy)
Rework, Modification and Repair of Electronic Assemblies
Englisch. Stand: 2017 396 Seiten.
This guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures. Color illustrations are included in many procedures. Over 300 pages. Released January 2017.
IPC-7711/21C (PDF) Single User
Rework, Modification and Repair of Electronic Assemblies
Englisch. Stand: 2017, 396 Seiten. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
This guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures. Color illustrations are included in many procedures. Over 300 pages. Released January 2017.
PDF-Datei ist DRM geschützt (rechnergebunden)! Bitte nennen Sie beim Kauf den vollständigen Namen und die E-Mailadresse des Users.
IPC-7711/21C-AM1 (Hardcopy)
Rework, Modification and Repair of Electronic Assemblies
Englisch. Stand: 31.07.2020, 16 Seiten.
Amendment 1 to IPC-7711/21C, the document provides procedures for removal and installation of D-Pak components
IPC-7711/21C-AM1 (PDF) Single User
Rework, Modification and Repair of Electronic Assemblies
Englisch. Stand: 2020, 16 Seiten. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Amendment 1 to IPC-7711/21C, the document provides procedures for removal and installation of D-Pak components
IPC-7711/21C-AM1-DE (PDF) Single User
Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen Ergänzung 1
Deutsch, 12 Seiten, Stand: 07/2020. Keine Druckberechtigung, DRM-geschützt, !!!ACHTUNG!!! NENNEN SIE BEI DER BESTELLUNG DEN USER (NAME+E-MAIL)
Ergänzung 1 zu IPC-7711/21C-DE, das Dokument enthält Verfahren für das Entfernen und Montieren von D-Pak-Komponenten.
